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The
900 Series features dual load lock, in-line, sputter
down, batch systems configured with an optional high vacuum load
lock and three or four target positions. High-rate DC magnetron
sputtering, single pass or multiple pass deposition and dual-level
high vacuum pumped load lock features support the versatility and
high-throughput of these production systems. Cathode and wafer
orientation are horizontal, allowing the sputtered material to be
transferred vertically. The 900 Series systems are popular for their
pure metal target deposition and convenient wafer-to-pallet loading
abilities. The 900 series includes the 903NT, 943NT, 944NT, 954NT
and 954NTX. The 954NT and the 954NTX offer up to four-target
capability. [return]
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