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The KDF Series 600 Batch sputter systems feature dual loadlock, in-line, vertical, side sputtering configurations. The systems can be configured with two or three RF/DC magnetron cathodes and RF etch. An optional high vacuum loadlock is also available. The 600 Series, are particularly suited to high density, low defect applications.

An example is the KDF 643GT In-line sputtering system. The KDF system offers advanced design features providing benefits such as tight process control, high reliability and extremely low defect rates. 

The systems can be configured with an optional high vacuum load lock and three or four target positions and have a 13 x 13-inch pallet size. The 600 Series systems are particularly popular for sensitive applications requiring target material that produces unusually high particulate contamination. The 600 Series includes the 603NT, 643NT, 644NT, 654NT, and 654NTX. The NTX series systems offer an extended sputter area to increase process uniformity. Both the 654NT and the 654NTX offer four-target versatility. [return]

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