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KDF's PVD in-line batch sputter tools are the most cost-effective and advanced tools available on the market. Throughout the KDF product line, versatility and high-throughput are key features. The simplicity of the systems' design ensures easy maintenance, flexibility for next generation process development, and the industries lowest cost of ownership. KDF's unique duel-level load lock design provides built-in high productivity and increased through put. It enables efficient, uninterrupted simultaneous substrate loading/unloading, while the coating process runs continually.

The backbone of the product line is the KDF series 600 and 900 systems. 

The 600 series is a sputter-sideways architecture and offers cassette-to-cassette operation for particle-free, reliable substrate handling.

The 900 series incorporates a sputter down configuration, and offers the process flexibility often required in an R&D environment.

The latest generation systems, the KDF 744 GT and 844 GT, are designed to meet the ever increasing demand for higher through-put, and larger substrates. The systems incorporate the advanced features found in the 600/900 series, with 2.5 times the substrate area. Through put for 8 inch wafers is increased by 4 times, and is available with cassette handling. The 800 series is even larger yet still meets our stringent particle performance requirements. 300 mm capacity can be as large as 4 wafers.

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