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KDF
744NT and 844NT
The
744NT and 844NT are large area, four-target, batch sputtering
systems, designed for processing high-density interconnect, 200mm
(744NT) or 300mm (844NT) semiconductor wafers and flat panel
displays. They are equipped with a high-vacuum load lock configured
with a substrate pre-heat that enables the tool's high throughput.
The tools offer a pallet area of 19 x 19 inches (for the 744NT) or
26.5 x 26.5 inches (for the 844NT) with a compact footprint that
uses less than one-third the floor space of competing equipment. The
tools can hold four 200mm (744NT) or 300mm (844NT) wafers or
multiple smaller wafers and features two processing pallets,
allowing an instantaneous change of wafer sixes and the ability to
process both the front and back sides of wafers. [return] |
